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碩士論文公告區 |
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| 年度： | 91 | |
| 姓名： | 高卜丞(Pu-Chen Kao) | |
| 論文題目(中)： | 以敲擊回音反應之轉換函數推估新舊混凝土黏結介面品質 | |
| 論文題目(英)： | Evaluation of the Bond Quality at the Repairing Interface Using the Transfer Function Derived from the Impact-Echo Method | |
| 摘要(中)： | ||
| 本研究乃是利用非破壞性檢測之敲擊回音法所新發展之轉換函數資料處理技術來探討新舊混凝土介面的黏結品質。混凝土結構的修復包括去除劣質或損壞的混凝土，再覆蓋新的修補材料，舊有混凝土適當的表面處理及新舊材料間之若存在粘結材料時其黏結強度為修補成敗與否的重要因素。 本研究分為實驗室和工地現場兩部分，在實驗室部分製作一個150cm*100cm*23cm的版狀試體在此試體的新舊混凝土介面上分區施作不同的表面處理並進行敲擊回音及拉拔破壞試驗；在工地現場部分是採用高架箱型樑之實際修補案例進行敲擊回音檢測的試驗結果，做進一步之轉換函數分析。研究結果顯示，在檢測到不良修補介面時會造成轉換函數中對應於混凝土版整體厚度的尖峰頻率降低，造成由此計算之版厚誤差百分比增加到16%以上，版厚振幅值降低以及對應於介面深度的尖峰振幅值變大。若上述三種指標均正常，則修補介面無明顯的孔隙瑕疵，但此時介面的粘結力的高低會與介面黏結材料的強度直接相關。 |
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| 摘要(英)： | ||
| This research uses the data process technology of new transfer function developed from impact-echo method of non-destructive test to evaluate the bond quality of an interface between the existing concrete and the non-shrinkage mortar. The repair of concrete structure contains of removing poor quality or damaged concrete, then covering new repair materials. The proper interface treatment of old concrete and the bond strength of the bonding materials are important factors for successful repairing. This research is separated into two parts as laboratory and field studies. About laboratory study, a plate specimen was cast. On the interface between the existing concrete and the non-shrinkage mortar, different surface treatments were done at different part. The impact-echo and pull-off tests were performed afterwards. About field study, a practical repairing case for box girder was used to proceed impact-echo test and to do advanced analysis of transfer function. This research shows that the peak frequency which corresponds to the whole thickness of concrete plate is lower down when you check the bad repairing interface. As a result, the error of calculated plate thickness is more than 16%. The amplitude of peak corresponding to plate thickness is also lower, and the peak amplitude corresponding to the depth of interface is larger. If these three indexes mentioned above are normal, there is no obvious flaw for repairing interface. However, on the other hand, the strength of bond interface is directly related to the strength of the bonding material. |
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| 檔案： | 沒有相關檔案 | |
| 相關連結： | http://ethesys.lib.cyut.edu.tw/ETD-db/ETD-search-c/view_etd?URN=etd-0825103-103455 | |