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碩士論文公告區 |
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| 年度： | 92 | |
| 姓名： | 李世偉(Shih-Wei Li) | |
| 論文題目(中)： | 利用超音波檢測結構物鋁門窗框是否密實 | |
| 論文題目(英)： | Ultrasonic Inspection of the Back-Filled Materials in Aluminum Window Frames | |
| 摘要(中)： | ||
| 隨著經濟急速成長及國人對工程品質與安全的重視，土木建築工程非破壞檢測（NonDestructive Testing, NDT）技術日益突顯其重要性。近年來老舊土木建築結構物之損壞修補亦受到重視，相關修補工法陸續被提出，混凝土品質檢驗應用於現場，為顧及時效及結構安全，僅能隨機抽樣進行，因此依簡便之非破壞性檢測法更甚為重要。 本研究基於超音波訊號顯示於示波器之回波，由於空隙對超音波的阻隔，導致時域信號會快速衰減，在多次反射後超音波訊號的振幅降低，利用此原理可以檢測出使用中或已完工的鋁門窗結構物背填料是否填充確實；採用四種分析方法與試驗比對後，發現「回波波形之重疊」與「反射訊號收斂所需時間」能較有效的判斷出背填料的填充情形，結果證實試驗之正確性。 本研究進一步於現地採用打診法，判斷鋁門窗背填料之狀況，再使用超音波技術檢測，經打診法所診斷之三種填充情況，分別檢測對應的位置，將其所得到之波形與數據，以「反射訊號收斂所需時間」與「回波波形之重疊」加以分析，最後比較之結果具有相當程度的一致性。 |
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| 摘要(英)： | ||
| The poor quality of back-filled materials of aluminum window frames can cause water leakage to concrete walls. Such problems are very common and can be a big threat to the durability of concrete buildings. To inspect the quality of the back-filled materials, the method of coin-tapping is often used by experienced technicians. This, however, only provides subjective and sometimes doubtful results. Current study is focused on the applications of quantitative nondestructive testing methods for in situ inspection of back-filled materials of aluminum window frames. Significant difference in attenuation has been observed for the pulse-echo signals due to different back-filled conditions of the window frames. A 20-MHz ultrasonic pulse was sent to the window frame and the echo signals were recorded for further analyses. Four methods were used to study and characterize an extensive amount of measurement data, taken under pre-fabricated back-filled conditions. The results showed that the most effective methods were the pulse echo overlap (PFO) and the elapse time to pseudo-steady waveform (ETPSW). Furthermore, the coin-tapping method was applied to a window frame mounted on the wall of an existing building. The same window frame was then subjected to both PFO and ERPSW. The results were in reasonable agreement with those obtained by the coin-tapping method. Therefore, the ultrasonic wave propagation can be used as an alternative to the coin-tapping method for in situ inspection of back-filled conditions of window frames. Such methods are based on quantitative data and more reliable than the coin-tapping method. | ||
| 檔案： | 沒有相關檔案 | |
| 相關連結： | http://ethesys.lib.cyut.edu.tw/ETD-db/ETD-search-c/view_etd?URN=etd-0823104-063115 | |